Tim Higgins
It is also the first 802.11n solution to be designed using 65 nanometer CMOS processes. The device is "less than half the size" of multi-chip 802.11n solutions and consumes up to 50 percent less power.
The BCM4322 is sampling now, with production quantities expected to ship in the first quarter of 2008.
TRENDnet today announced the TEW-445UB 108Mbps High Power Wireless USB 2.0 adapter. The adapter supports up to 23dBm transmit power for network coverage with less interference at extended ranges.
Mesh Wi-Fi maker eero's future is looking hazier.
Broadcom has announced new SoC's to get the most out of its draft 802.11ac wireless devices.
