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b_550_0_16777215_00_images_stories_news_ces2018_celenoeverestchip.jpg

The new Everest chip solution from Celeno, targeting companies interested in moving to the latest 802.11 standard, includes new features including uplink/downlink MU-OFDMA and MU-MIMO, high order 1024 QAM modulation, and trigger-based scheduling.

Available in a 12x12 BGA package, Everest, with its PCIe-based interface, uses 14nm FinFET node technology, and utilizes Celeno’s own AX.L subsystem to produce link rates up to 4.8 Gbps, as well as supporting 2.4 and 5 GHz bands.

Details on pricing, availability, or samples were not announced.Celeno will have a hospitality suite at CES 2018 in Las Vegas.

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